Electro and Electroless Plating
At Elcon, we recognize the importance of quality plating as it reflects on the overall performance of the component.
We offer the following plating methods and specifications:
- "Soft” Gold per MIL-G-45204, Type III, Grade A or per ASTM B488, Type III, Code A
Silver per QQ-S-365, Type II (semi-bright), Grade B or ASTM B700 Type 1, Semibright, Class N
- Electrolytic Nickel per QQ-N-290, Class 2 or ASTM B689, Type 1 or MIL-P-27418 (low stress)
- Electroless Nickel-Boron per ASTM B607
- Electrolytic Copper per ASTM B734
Specification |
Mil |
Superceded or Replaced |
SAE/AMS/etc |
ASTM |
Copper Plating |
MIL-C-14550B
|
Superceded 1998 |
AMS 2418 |
ASTM B 734-97 |
Electroless Nickel Boron (.5%) |
|
Superceded 2003 |
AMS 2399 |
ASTM B607-91 |
Electroless Nickel Mid Phosphorous |
MIL-C-26074 |
Superceded 2003 |
AMS 2404
AMS-C-26074 |
ASTM B 733-04 |
Gold Industrial (24 Carat) |
MIL-G-45204 |
Replaced MIL-DTL-45204 |
AMS 2422 |
ASTM B488 -01
Type IIIA |
Nickel Plating |
QQ-N-290 |
Superceded 2001 |
AMS 2403 |
ASTM B 689-97 |
Sulfamate Nickel |
MIL-P-27418 |
Inactivated 1998 |
AMS 2403 |
|
Silver Plating |
QQ-S-365 |
Inactivated 2001 |
|
ASTM B 700-08 |
Test plan for Processing solutions |
|
|
ARP4992 |
|
Microsurface Test Methods |
MIL-STD-883F |
|
|
|
Calibration of Equipment |
MIL-STD-45662 |
Replaced 1995 |
ANSIZ540.3 |
|
Hybrid Microcircuits |
MIL-STD-1772 |
Superceded 1995 |
MIL-PRF-38534 |
|
Inspection System requirements |
MIL-I-45208 |
Cancelled |
AS9100B |
|
| 
INDUSTRIES SERVED