Chemical Milling, Lead Frames

High Precision Lead Frame Components (Chemically Etched)

Elcon is organized to serve the packaging needs of the semiconductor industry. Comprehensive lead frame manufacturing capabilities have been established to provide the highest level of service. Elcon can design lead frames from conception and/or take over an already designated drawing and deliver the end products. Copper and alloy 42 are frequently used base metals, but Elcon has the know-how to etch a multitude of other metals. Spot plating, taping, and downset operations are standard procedures. Elcon is committed to provide the industry with high quality products. Download Page #1 PDF Download Page #2 PDF

Standard Photo-Etching Tolerances For Lead Frames (Normally Controlled) Material Thickness 0.005" 0.006" 0.008" 0.010" General ± 0.002" Unit Pitch ± 0.001" Total Pitch ± 0.002" Strip Length ± 0.004" Tooling Hole Diameter ± 0.001" Lead Tip Position ± 0.002" Minimum Anchor Hole Diameter 0.007" 0.008" 0.010" 0.012" Maximum Corner Radius 0.006" 0.008" Plating   Gold (Au) Spot Silver (Ag) Spot Base Metal Alloy 42 Cu Alloy Alloy 42 Cu Alloy Plating Thickness Dtermined by Drawing Taping Description Tolerances Two-Sided Tape Tape Width Cut Dimension ± 0.010" ± 0.005" Four-Sided Tape Tape Width Cut Dimension ± 0.010" ± 0.005" Notes: Standard capabilities have been illustrated. Other advanced capabilities are available. All dimensions are in inches